Henkel Adhesive Technologies
Universal Bonder 


Product category: Structural adhesives

Data sheets

Product information

LOCTITE® HY 4070 Universal Bonder is designed for the assembly of parts with bond gaps up to 0.2 in (5 mm), and/or for applications where the complete cure of excess adhesive is a must. The gel consistency prevents adhesive flow even on vertical surfaces. HY 4070 is ideally suited for applications where temperature and moisture resistance is required.

Best application results are achieved with use of the LOCTITE cyanoacrylate mixing nozzle (contained in the 11 gram kit).

Application method: 

Dispense System


Bonding Dissimilar Materials,Bonding Plastic,Bonding Rubber,Construction,Direct Bonding,Edge Bonding,Interior Repairs,Structural Bonding

Cure type:

Room Temperature (Ambient) Cure,Two Component Mix

FEA (finite element analysis):

Finite Strain,Viscoelastic

Fixture time, Aluminum (etched), 0.5mm gap:

< 60.0 sec.

Gap fill:

5.0 mm

Hardener: Color:


Hardener: Viscosity, cone & plate, @ 25.0 °C:

1.0 mPa·s (cP) - 30.0 mPa·s (cP)

Mix ratio, by volume:

10 : 1

Mixed: Key characteristics:

Cure Speed: Ultra Fast Cure,Gap Filling,Moisture Resistant,Multipurpose

Mixed: Operating temperature:

-40.0 °C - 100.0 °C (-40.0 °F - 212.0 °F)

Number of components:

2 Part

Physical form:


Resin: Casson viscosity, cone & plate, @ 25.0 °C:

200.0 mPa·s (cP) - 1300.0 mPa·s (cP)

Resin: Color:


Shear strength, Steel (grit blasted):

25.0 N/mm² (3625.0 psi)


Composite,Composite: Advanced Composites,Dry Surface,Elastomer: Highly Filled Elastomer,Epoxy,Fiberboard,Gel Coat,Laminate,Metal,Non-Gel Coat,Painted Surface,Phenolic,Plastic,Rubber,Thermoplastic,Thermoset,Urethane: Cast Urethane,Vinyl,Wood

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